BAE Systems and GlobalFoundries (GF) have formally entered a strategic partnership aimed at significantly advancing and streamlining the supply chain for high-reliability, radiation-hardened (rad-hard) microelectronics essential for next-generation space missions. This collaboration directly addresses the pressing industry need for more rapid access to cutting-edge, resilient chip technology.
The partnership leverages GlobalFoundries’ state-of-the-art U.S.-based manufacturing capabilities—specifically its specialized 300mm wafer fabrication processes—and BAE Systems’ decades of expertise in designing and producing certified rad-hard components for mission-critical satellite and deep-space applications.
Addressing the Capability Gap
Traditionally, the space microelectronics sector has lagged commercially available technology due to the stringent requirements for surviving the harsh radiation environment of orbit. This new agreement seeks to bridge that gap by applying advanced commercial manufacturing techniques to produce trusted components capable of withstanding extreme conditions, including exposure to high-energy particles and cosmic rays.
By utilizing GF’s existing, high-volume fabrication lines, the companies expect to achieve greater manufacturing efficiency and higher yield rates compared to existing, more specialized facilities. This is crucial for increasing the supply velocity and affordability of devices like Field-Programmable Gate Arrays (FPGAs), memory, and specialized ASICs (Application-Specific Integrated Circuits) vital for on-board data processing, command and control, and satellite communication systems.
Enhancing Supply Chain Resilience
A key focus of this collaboration is reinforcing the domestic supply chain for space-grade electronics. Manufacturing these critical components within secure, trusted U.S. facilities mitigates geopolitical risk and ensures compliance with strict defense and national security requirements. This partnership directly supports government and commercial space programs that demand assured access to high-performance, rad-hard components for platforms ranging from Low Earth Orbit (LEO) constellations to complex national security satellites.
This joint effort is expected to accelerate the insertion of new technologies into spacecraft architectures, reducing the time-to-market for advanced processing capabilities. This improved capability will, in turn, enable satellites to perform more sophisticated tasks, process data faster on-orbit, and enhance communication throughput—all critical factors in the rapidly expanding space economy.
The BAE Systems and GlobalFoundries alliance represents a significant step forward in transforming how the industry sources and utilizes advanced, high-reliability microelectronics for the enduring demands of the space domain.