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Using Calibre for High Density Advanced Packaging (HDAP) Verification: Part 1
July 29, 2020 UTC-7
As a Calibre verification engineer, or a semiconductor packaging engineer concerned about package verification, would you be interested in learning why many of the leading fabless semiconductor companies choose to verify their high density advanced packaging (HDAP) assemblies with Calibre? This two-part webinar series is your chance to find out!
In this first webinar, we will present an overview of HDAP technologies, including why they’re needed and how they’re being used today. We also introduce the Calibre 3DSTACK tool and explain how it provides Calibre signoff verification for HDAP assemblies.